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Products

PLD System

PLD / Laser-MBE System Lines

Laser MBE System (Laser Molecular Beam Epitaxy system)은 PVD시 스퍼터링 타겟을 녹이기 위하여 고출력 펄스형 레이저를 이용하는 PLD(Plused Laser Deposition) 장비입니다.
단원소 혹은 다원소 박막의 증착 도중 이들의 두께를 원자단위로 제어하는 것을 가능하게 해주어 초박막(Ultra-Thin Film)이나 규칙 격자(Super Lattice) 박막 제조가 가능하게 해주며 원재료와 동일한 조성비를 갖는 박막의 제조가 가능하여 고품질 박막 제조에 활용되고 있으며, 크게 Compact 타입과 Mobile Combi 타입으로 분류됩니다

Consultation Inquiry

SPECS

1. Compact Laser MBE System

○Feature

* 작동이 용이한 콤팩트 디자인

* 적외선 램프 가열 방식 (옵션 : SiC 히팅 가능)

* Transfer Rod에 의한 기판 및 타겟의 교환 용이

* 연속 회전이 가능한 자기결합(Magnetic coupled) 타겟 회전

* 다양한 구송요소를 장착하기 위한 보조 포트

Configuration

Deposition Chamber size	φ260mm spherical
Substrate heating	10mm square, Diode laser heating
Substrate tempurature monitor	Pyrometer
Target	φ20mm×4 Target-laser synchroneizer (PC and software)
Load-lock transfar module	100mm×200mmH Transfar rod, 2 substrates, 2 targets
Main vaccum pump	Ceramics bearing TMP 300L/s
Combinatorial mask mechanism	Motor driven. 2 Masks
RHEED	Parallel Scannin RHEED, RHEED pattern processing system

Specification

1. Growth chamber

Arrival pressure

less than 6.7×10^-7Pa (5×10^-9Torr)

Chamber

ca. φ300mm×500mm high. cylindrical(SUS304)

Exhaust speed

less than 10^-4Pa (10^-6Torr) in 20 minutes

Substrate holder with radiation
heating by infrared lamp

Heating temperature :	more than 800°C within 15mm square of substrate holder
Temperature uniformity :	less than?±2.5°C within 15mm square
Substrate size :	up to φ50mm
Substrate movement :	X : ±10mm
	Y : ±10mm
	Z1 : ±20mm
	Z2 : 0~20mm
	Rotation : AC motor driven
Shutter for substrate	CF1.33", pneumatic Flange CF10"
Flange	CF10"
Water cooling
Power control	Programmable PID controlled DC
power supply
Thermocouple	Type R

Target holder with revolver

Target loading	φ20mm×4 (6 : optional)
Target movement	Horizontal X : ±10mm
	Horizontal Y : ±10mm
	Vertical Z : ±20mm
Target spin mechanism	Motor driven via mgnetic rotation feedthrough
Revolution mechanism	Stepping-motor driven

Process gas flow

via variable leak valve for O₂

via manual valve for O₂ at around atmospheric pressure

reserve port for gas inlet

Laser irradiation

via synthesized quartz window (CF4.5") at an angle of 45° to a target
Window trasparency	more than 93% for ArF
	more than 93% for KrF

Vacuum gauges

for UHV	nude ionization gauge
for low vacuum	Capacitance manometor 1Torr

Pumps

Main pump	magnetic-bearing TMP (800L/s) for wide-vacuum-range use
Rotary pump	275L/m

Main valve	6" pneumatic
Baypass line	pneumatic and manual operation
Pressure monitor

Bake-out heater

Sheath heater and tape heater
Temperature controllable range	100°C ~ 200°C

Ports

for target observation	CF6"
for thickness monitor or mask	CF6"
for cells	CF4.5" ×2
for temperature measurement	CF4.5"
for gasintroduction	CF2.75"
for RHEED gun	CF4.5"
for RHEED screen	CF6"

2. Load-lock and substrate transfer mechanism

Load-lock chamber

ca.φ150mm×200mm high. (SUS304)
Ultimate pressure	6.7×10^-5Pa(5×10^-7Torr)
Access door with window
Sample capacity	2 substrates and 4 targets
Vent line
auxiliary port	CF2.75"
Pumps	70L/s TMP and Rotary pump
Vacuum gauge

Substrate transfer

Magnetic coupled transfer rod X-Y movable stage

Gate valve to the growth
chamber

4" manual valve

Bake-out heater

Tape heater 2m×5

3. system rack

JIS standard rack for controllers and power supplies ×2

4. Utilities

AC100V 1φ 50A

AC200V 3φ 30A

Dry N₂ gas

compressed air 5kg/cm² (pressure regulator supplies)

Cooling water

Any construction of laboratory room is not included.

Gases for user's process are not included.

5. Control systemSpecifications may subject to change for improvement without notice.

Electro-manually controlled power supply : control of vaccum valve
Interlock :	Deficient flow of cooling water for infrared lamp heating
	Deficient pressure of compressed air for pneumatic valve drive
	Preservation of high vacuum in each chamber after an electric power failure (Manual recovery only)
	Urgent shutdown function

Option

Differentially pumped RHEED gun
2-stage differentially pumped RHEED gun
Parallel scanning RHEED gun
RHEED pattern processing system
Laser diode heating component
6 targets holder with revolver
Target-laser synchronizer (PC and software)
Encounter mask mechanisms
Radigcal beam source
Ozone source (or ozonizer component)
Pyrometer
Laser for abration ; Nd:YAG (3ω 355nm)
Laser for abration ; Excimer (KrF 248nm)
Optics components and optical box

Configuration

Deposition Chamber size	φ260mm spherical
Substrate heating	10mm square, Diode laser heating
Substrate tempurature monitor	Pyrometer
Target	φ20mm×4 Target-laser synchroneizer (PC and software)
Load-lock transfar module	100mm×200mmH Transfar rod, 2 substrates, 2 targets
Main vaccum pump	Ceramics bearing TMP 300L/s
Combinatorial mask mechanism	Motor driven. 2 Masks
RHEED	Parallel Scannin RHEED, RHEED pattern processing system

Specification

1. Growth chamber

Arrival pressure

less than 6.7×10^-7Pa (5×10^-9Torr)

Chamber

ca. φ300mm×500mm high. cylindrical(SUS304)

Exhaust speed

less than 10^-4Pa (10^-6Torr) in 20 minutes

Substrate holder with radiation
heating by infrared lamp

Heating temperature :	more than 800°C within 15mm square of substrate holder
Temperature uniformity :	less than?±2.5°C within 15mm square
Substrate size :	up to φ50mm
Substrate movement :	X : ±10mm
	Y : ±10mm
	Z1 : ±20mm
	Z2 : 0~20mm
	Rotation : AC motor driven
Shutter for substrate	CF1.33", pneumatic Flange CF10"
Flange	CF10"
Water cooling
Power control	Programmable PID controlled DC
power supply
Thermocouple	Type R

Target holder with revolver

Target loading	φ20mm×4 (6 : optional)
Target movement	Horizontal X : ±10mm
	Horizontal Y : ±10mm
	Vertical Z : ±20mm
Target spin mechanism	Motor driven via mgnetic rotation feedthrough
Revolution mechanism	Stepping-motor driven

Process gas flow

via variable leak valve for O₂

via manual valve for O₂ at around atmospheric pressure

reserve port for gas inlet

Laser irradiation

via synthesized quartz window (CF4.5") at an angle of 45° to a target
Window trasparency	more than 93% for ArF
	more than 93% for KrF

Vacuum gauges

for UHV	nude ionization gauge
for low vacuum	Capacitance manometor 1Torr

Pumps

Main pump	magnetic-bearing TMP (800L/s) for wide-vacuum-range use
Rotary pump	275L/m

Main valve	6" pneumatic
Baypass line	pneumatic and manual operation
Pressure monitor

Bake-out heater

Sheath heater and tape heater
Temperature controllable range	100°C ~ 200°C

Ports

for target observation	CF6"
for thickness monitor or mask	CF6"
for cells	CF4.5" ×2
for temperature measurement	CF4.5"
for gasintroduction	CF2.75"
for RHEED gun	CF4.5"
for RHEED screen	CF6"

2. Load-lock and substrate transfer mechanism

Load-lock chamber

ca.φ150mm×200mm high. (SUS304)
Ultimate pressure	6.7×10^-5Pa(5×10^-7Torr)
Access door with window
Sample capacity	2 substrates and 4 targets
Vent line
auxiliary port	CF2.75"
Pumps	70L/s TMP and Rotary pump
Vacuum gauge

Substrate transfer

Magnetic coupled transfer rod X-Y movable stage

Gate valve to the growth
chamber

4" manual valve

Bake-out heater

Tape heater 2m×5

3. system rack

JIS standard rack for controllers and power supplies ×2

4. Utilities

AC100V 1φ 50A

AC200V 3φ 30A

Dry N₂ gas

compressed air 5kg/cm² (pressure regulator supplies)

Cooling water

Any construction of laboratory room is not included.

Gases for user's process are not included.

5. Control systemSpecifications may subject to change for improvement without notice.

Electro-manually controlled power supply : control of vaccum valve
Interlock :	Deficient flow of cooling water for infrared lamp heating
	Deficient pressure of compressed air for pneumatic valve drive
	Preservation of high vacuum in each chamber after an electric power failure (Manual recovery only)
	Urgent shutdown function

Option

Differentially pumped RHEED gun
2-stage differentially pumped RHEED gun
Parallel scanning RHEED gun
RHEED pattern processing system
Laser diode heating component
6 targets holder with revolver
Target-laser synchronizer (PC and software)
Encounter mask mechanisms
Radigcal beam source
Ozone source (or ozonizer component)
Pyrometer
Laser for abration ; Nd:YAG (3ω 355nm)
Laser for abration ; Excimer (KrF 248nm)
Optics components and optical box

2. Mobile Combi-Laser MBE System

○ Feature

* 작동이 용이한 콤팩트 디자인

* 최대진공압력 : 2×10-9Torr

* 2개의 구동모터로 조합마스크 가능

* 4개까지 타겟 이용

* 기본 2개의 RHEED 구성

* 컴퓨터 제어방식

Configuraion

Deposition Chamber size	300mm×500mmH
Substrate heating	2-inch lamp heating
Target	φ20mm×4
Load-lock transfar module	φ150mm×200mmH Transfar rod, 2 substrates, 4 targets
Main vaccum pump	Magnetic bearing TMP 800L/s
Combinatorial mask mechanism	None (optional)
RHEED	None (optional)

Specification

1. Growth chamber

Arrival pressure

less than 2.7×10^-7Pa (2×10^-9Torr)

Chamber

ca. φ260mm Spherical (SUS304)

Laser Irradiation

through a synthesized quartz window (CF4.5")

Vacuum gauges

a nude ionization gauge and a capacitance manometor

Exhaust system

Main pump	300L/s TMP
Fore pump	250L/m scroll pump
Valve	CF6" gate valve
Fore-line monitor	T/C gauge

Process gas flow

Variable-leak valve

Air vant valve

φ1/4-inch nozzle facing a substrate (SUS)

Target holder with revolver

Target loading	φ20mm×4
Target spin mechanism	AC motor driven with speed control
Revolution mechanism	Stepping motor driven
Revolution control	via Lab View^TM

Substrate holder / heate

Substrate heating	a laser diode heating (808nm, 140W) with chiller
Temperature gradient	more than 200°C attainable
Temperature maeasurement	180°C~1400°C
Temperature maeasurement	(measurable less than φ2mm spot size on a substrate by a pyrometer)
Substrate rotation	Stepping-motor driven (sensor equipped)
Substrate size	10mm square

Combinatorial masks

Number of masks	Moving mask ×1, Contact mask ×1
Moving mask control	LabView^TM controlled motor driven

Parallel Scanning RHEED
device

differentially pumped RHEED gun (CF2.75")
30kv of acceleration voltage
CF6" screen for RHEED pattern observation
Focusing / Scanning coils for area scan of whole substrate surgace
Pattern processing	CCD camera, dark box and processing software (LabView^TM)

2. Load-lock chamber

Chamber	φ100mm Cylindrical SUS304
Sample capacity	substrate ×2, Target ×2
Rotation / Elevation stage
Isolation valve	4.5" gate valve
Substrate/target handling	Access door
Vaccuum Monitor	nude ionization gauge (CF2.75")
pumping	70L/s TMP
Sample transfer	Magnetic coupled transfer rod with tilt mechanism

3. Controlled function

Systematic and fully control of combinatorial sample fabrication with PC via LabView^TM

a) Mask motion

b) Target revolution and arm-angle

c) Substrate rotation control

d) RHEED oscillation monitor

e) Laser trigger

f) Substrate temperature

4. Utilites

Specifications many subject to change for improvement without notice.
AC100V 1φ 50A
AC200V 3φ 50A
O₂gas, N₂gas
Compressed air 5kg/cm²(pressure regulator supplied)
Cooling water
Any construction of laboratory room is not included.
Gases for user's process are not included.

Option

Radigcal beam source
Ozone source (or ozonizer component)
Laser for abration ; Nd:YAG (3ω 355nm)
Laser for abration ; Excimer (KrF 248nm)
Optics components and optical box