Product Overview

Crystal cleavage means that the crystal fracture surface is separated along a certain crystal surface (cleavage surface) under the action of normal stress. For two-dimensional layered materials, the inner layer is bound by strong covalent bond or ionic bond, while the interlayer is mostly dependent on weak van der Waals force. Generally, the simple ceramic stick and glue method can peel out fresh and high-quality crystal surface. However, for materials with three-dimensional properties, such as metal or semiconductor materials, it is difficult to obtain smooth cleavage planes due to strong interlayer forces.

The cryogenic in-situ cleavage system developed by Fermion Instruments can realize the cleavage of semiconductor single crystal and hard ion crystal under high vacuum and low temperature conditions. Ultra-high vacuum can protect the fresh sample surface, while low temperature can improve the brittleness of the sample and obtain a smoother cleavage surface. The equipment is vacuum-connected with the surface analysis equipment to realize in-situ dissociation, polishing and transfer of the whole process, meet different users' experimental research on the surface properties of various materials, and expand a more abundant sample source for angular resolution photoelectron spectroscopy (ARPES) and scanning tunneling microscope (STM).

Specification

●  Can realize variable temperature environment, the lowest temperature < 100 k, for metals materials can get a better cleavage surface under the brittle point

●  Can realize ultra-high vacuum environment, vacuum is better than 5 x10-10 mbar

●  Can achieve precise cleavage crystal of large size samples, the largest cross section size 5 mm x 5 mm

●  Easy operation, can be realized in-situ cleavage can be realized with the wobble stick

●  Cleavage plane atomic level of smoothness can be realized

●  Standard Flag Type Sample Holder, compatible with ARPES, STM, and XPS surface analysis equipment

●  Besides as an independent system through vacuum interconnection, the cleavage stage also can be used as a compatible modules installed in ARPES, STM, expanding the scope of the study of the existing system