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Product

Laser MBE System (PLD설비)

Laser MBE System (Laser Molecular Beam Epitaxy system)은 PVD시 스퍼터링 타겟을 녹이기 위하여
고출력 펄스형 레이저를 이용하는 PLD(Plused Laser Deposition) 장비입니다.

단원소 혹은 다원소 박막의 증착 도중 이들의 두께를 원자단위로 제어하는 것을 가능하게 해주어
초박막(Ultra-Thin Film)이나 규칙 격자(Super Lattice) 박막 제조가 가능하게 해주며 원재료와 동일한 조성비를 갖는
박막의 제조가 가능하여 고품질 박막 제조에 활용되고 있으며, 크게 Compact 타입과 Mobile Combi 타입으로 분류됩니다

1. Compact Laser MBE System

Feature
* 작동이 용이한 콤팩트 디자인
* 적외선 램프 가열 방식 (옵션 : SiC 히팅 가능)
* Transfer Rod에 의한 기판 및 타겟의 교환 용이
* 연속 회전이 가능한 자기결합(Magnetic coupled) 타겟 회전
* 다양한 구송요소를 장착하기 위한 보조 포트
Configuration
상세테이블
Deposition Chamber size φ260mm spherical
Substrate heating 10mm square, Diode laser heating
Substrate tempurature monitor Pyrometer
Target φ20mm×4
Target-laser synchroneizer (PC and software)
Load-lock transfar module 100mm×200mmH
Transfar rod, 2 substrates, 2 targets
Main vaccum pump Ceramics bearing TMP 300L/s
Combinatorial mask
mechanism		 Motor driven. 2 Masks
RHEED Parallel Scannin RHEED, RHEED pattern processing system
Specification

1. Growth chamber

상세테이블
Arrival pressure less than 6.7×10-7Pa (5×10-9Torr)
Chamber ca. φ300mm×500mm high. cylindrical(SUS304)
Exhaust speed less than 10-4Pa (10-6Torr) in 20 minutes
Substrate holder with radiation
heating by infrared lamp
Heating temperature : more than 800°C within 15mm square of substrate holder
Temperature uniformity : less than?±2.5°C within 15mm square
Substrate size : up to φ50mm
Substrate movement : X : ±10mm
Y : ±10mm
Z1 : ±20mm
Z2 : 0~20mm
Rotation : AC motor driven
Shutter for substrate CF1.33", pneumatic Flange CF10"
Flange CF10"
Water cooling
Power control Programmable PID controlled DC
power supply
Thermocouple Type R
Target holder with revolver
Target loading φ20mm×4 (6 : optional)
Target movement Horizontal X : ±10mm
Horizontal Y : ±10mm
Vertical Z : ±20mm
Target spin mechanism Motor driven via mgnetic rotation feedthrough
Revolution mechanism Stepping-motor driven
Process gas flow
via variable leak valve for O2
via manual valve for O2 at around atmospheric pressure
reserve port for gas inlet
Laser irradiation
via synthesized quartz window (CF4.5") at an angle of 45° to a target
Window trasparency more than 93% for ArF
more than 93% for KrF
Vacuum gauges
for UHV nude ionization gauge
for low vacuum Capacitance manometor 1Torr
Pumps
Main pump magnetic-bearing TMP (800L/s) for wide-vacuum-range use
Rotary pump 275L/m
Main valve 6" pneumatic
Baypass line pneumatic and manual operation
Pressure monitor
Bake-out heater
Sheath heater and tape heater
Temperature controllable range 100°C ~ 200°C
Ports
for target observation CF6"
for thickness monitor or mask CF6"
for cells CF4.5" ×2
for temperature measurement CF4.5"
for gasintroduction CF2.75"
for RHEED gun CF4.5"
for RHEED screen CF6"

2. Load-lock and substrate transfer mechanism

Load-lock chamber
ca.φ150mm×200mm high. (SUS304)
Ultimate pressure 6.7×10-5Pa(5×10-7Torr)
Access door with window
Sample capacity 2 substrates and 4 targets
Vent line
auxiliary port CF2.75"
Pumps 70L/s TMP and Rotary pump
Vacuum gauge
Substrate transfer Magnetic coupled transfer rod X-Y movable stage
Gate valve to the growth
chamber		 4" manual valve
Bake-out heater Tape heater 2m×5

3. system rack

JIS standard rack for controllers and power supplies ×2

4. Utilities

AC100V 1φ 50A
AC200V 3φ 30A
Dry N2 gas
compressed air 5kg/cm2 (pressure regulator supplies)
Cooling water
Any construction of laboratory room is not included.
Gases for user's process are not included.

5. Control system Specifications may subject to change for improvement without notice.

Electro-manually controlled power supply : control of vaccum valve
Interlock : Deficient flow of cooling water for infrared lamp heating
Deficient pressure of compressed air for pneumatic valve drive
Preservation of high vacuum in each chamber after an electric power failure (Manual recovery only)
Urgent shutdown function
 
Option
  • Differentially pumped RHEED gun
  • 2-stage differentially pumped RHEED gun
  • Parallel scanning RHEED gun
  • RHEED pattern processing system
  • Laser diode heating component
  • 6 targets holder with revolver
  • Target-laser synchronizer (PC and software)
  • Encounter mask mechanisms
  • Radigcal beam source
  • Ozone source (or ozonizer component)
  • Pyrometer
  • Laser for abration ; Nd:YAG (3ω 355nm)
  • Laser for abration ; Excimer (KrF 248nm)
  • Optics components and optical box

2. Mobile Combi-Laser MBE System

Feature
* 작동이 용이한 콤팩트 디자인
* 최대진공압력 : 2×10-9Torr
* 2개의 구동모터로 조합마스크 가능
* 4개까지 타겟 이용
* 기본 2개의 RHEED 구성
* 컴퓨터 제어방식
Configuraion
Deposition Chamber size 300mm×500mmH
Substrate heating 2-inch lamp heating
Target φ20mm×4
Load-lock transfar module φ150mm×200mmH
Transfar rod, 2 substrates, 4 targets
Main vaccum pump Magnetic bearing TMP 800L/s
Combinatorial mask
mechanism		 None (optional)
RHEED None (optional)



Specification

1. Growth chamber

Arrival pressure less than 2.7×10-7Pa (2×10-9Torr)
Chamber ca. φ260mm Spherical (SUS304)
Laser Irradiation through a synthesized quartz window (CF4.5")
Vacuum gauges a nude ionization gauge and a capacitance manometor
Exhaust system
Main pump 300L/s TMP
Fore pump 250L/m scroll pump
Valve CF6" gate valve
Fore-line monitor T/C gauge
Process gas flow
Variable-leak valve
Air vant valve
φ1/4-inch nozzle facing a substrate (SUS)
Target holder with revolver
Target loading φ20mm×4
Target spin mechanism AC motor driven with speed control
Revolution mechanism Stepping motor driven
Revolution control via Lab ViewTM
Substrate holder / heate
Substrate heating a laser diode heating (808nm, 140W) with chiller
Temperature gradient more than 200°C attainable
Temperature maeasurement 180°C~1400°C
(measurable less than φ2mm spot size on a substrate by a pyrometer)
Substrate rotation Stepping-motor driven (sensor equipped)
Substrate size 10mm square
Combinatorial masks
Number of masks Moving mask ×1, Contact mask ×1
Moving mask control LabViewTM controlled motor driven
Parallel Scanning RHEED
device
differentially pumped RHEED gun (CF2.75")
30kv of acceleration voltage
CF6" screen for RHEED pattern observation
Focusing / Scanning coils for area scan of whole substrate surgace
Pattern processing CCD camera, dark box and processing software (LabViewTM)

2. Load-lock chamber

Chamber φ100mm Cylindrical SUS304
Sample capacity substrate ×2, Target ×2
Rotation / Elevation stage
Isolation valve 4.5" gate valve
Substrate/target handling Access door
Vaccuum Monitor nude ionization gauge (CF2.75")
pumping 70L/s TMP
Sample transfer Magnetic coupled transfer rod with tilt mechanism

3. Controlled function

Systematic and fully control of combinatorial sample fabrication with PC via LabViewTM
a) Mask motion
b) Target revolution and arm-angle
c) Substrate rotation control
d) RHEED oscillation monitor
e) Laser trigger
f) Substrate temperature

4. Utilites

Specifications many subject to change for improvement without notice.
AC100V 1φ 50A
AC200V 3φ 50A
O2gas, N2gas
Compressed air 5kg/cm2(pressure regulator supplied)
Cooling water
Any construction of laboratory room is not included.
Gases for user's process are not included.

Option
  • Radigcal beam source
  • Ozone source (or ozonizer component)
  • Laser for abration ; Nd:YAG (3ω 355nm)
  • Laser for abration ; Excimer (KrF 248nm)
  • Optics components and optical box